Integration benefits
- Managed flash reduces low-level NAND work at the host
- Standard eMMC 5.1 interface and compact VFBGA package
- Commercial and industrial temperature options
- pSLC option for higher-write-endurance requirements
Embedded storage · eMMC 5.1
Embedded eMMC 5.1, 4 GB-128 GB, Commercial & Industrial Options
Published portfolio range · model by quotation
- Capacity
- 4 GB / 8 GB / 16 GB / 32 GB / 64 GB / 128 GB
- Interface
- eMMC 5.1
- Supply Voltage
- VCC: 2.7-3.6 VVCCQ: 1.65-1.95 V / 2.7-3.6 V
- Sequential R/W
- Up to 300 / 200 MB/s
- Random R/W
- Up to 25K / 15K IOPS
- Flash Options
- MLC / TLC · pSLC high-endurance option
- Temperature
- Commercial: -25 to 85°CIndustrial: -40 to 85°C
- Package
- 153-ball VFBGA · 11.5 × 13.0 × 1.0 mm
- High Endurance
- Selected pSLC option · up to 30K P/E cycles; model and test conditions apply
Published portfolio range. Capacity, NAND, package, temperature and performance depend on the selected model. The up-to-30K P/E option applies only to the qualified pSLC configuration and its stated NAND, capacity and test conditions; it is not a rating for every eMMC. Confirm the exact part, sample and current availability in the quotation.
Embedded-storage range
Compact managed flash for integrated systems.
eMMC combines NAND flash and a controller in one package, simplifying host integration and low-level flash management.
| Capacity | Interface | Maximum sequential R/W | Maximum random R/W | Flash options | Temperature grades |
|---|---|---|---|---|---|
| 4 GB-128 GB | eMMC 5.1 | 300 / 200 MB/s | 25K / 15K IOPS | MLC / TLC / pSLC | -25 to 85°C commercial -40 to 85°C industrial |
The specification table describes the available portfolio range. Not every capacity is offered in every NAND, temperature or endurance combination.
Application fit
Designed around compact, reliable embedded storage.
Typical applications
- Set-top boxes and network terminals
- Tablets and mobile devices
- Video surveillance equipment
- Wearables, IoT, industrial and power-system terminals
Start with the host, capacity and environment.
Send the processor, eMMC revision, capacity, temperature, endurance requirement and project volume.